- Brand: Mechanic
- Model: XG-40
- Viscosity: 1 (Pa · S)
- Particle size: 1 (um)
- Alloy composition: tin
- Activity: medium
- Type: lead solder paste
- Cleaning angle: no need to clean
- Melting point: 183
- Type: Chip Solder Paste
- Operating temperature: 300 ° C
- Scope of application: tin mobile computer motherboard chip
Important Instructions
- Harmful by inhalation and if swallowed (R 20/22)
- Danger of cumulative effects. (R 33)
- Keep away from food, drink and animal feed. (S 13)
- When using, do not ingest, drink or smoke. (S 20/21)
- Avoid prolonged or repeated contact of any skin with solder paste. In case of ingestion of solder paste consult a doctor immediately.
- Store container tightly closed and cool. (from 5 to 10 ℃)
